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Scrub Cleaner - List of Manufacturers, Suppliers, Companies and Products

Scrub Cleaner Product List

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Dual-Sided Simultaneous Scrub Cleaning Device (Ultrasound Combined) DSS-320

Dual-Sided Simultaneous Scrub Cleaning Device (Ultrasound Combined) DSS-320

Dual-Sided Simultaneous Scrub Cleaning Device (Ultrasonic Combined) DSS-320

High-density special brush adopted! Simultaneous double-sided! Ultrasonic combined scrubber ■□■ Features ■□■ ■ Prevents accumulation of contamination on the brush by scrubbing in water ■ Immersion scrub method that prevents reattachment of dirt to the substrate ■ No need to change setup for sizes from 0.1mm to 1mm ■ Double cleaning with scrub + ultrasonic ■ Cassette-to-cassette method adopted ■ Applicable workpieces: Φ3” to 6”Φ, 0.1mm to 1mm square, round ■ For other functions and details, please download the catalog or contact us.

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  • Ultrasonic Oscillator

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Scrubber cleaning device

Scrubber cleaning device

Scrub cleaning device

For stubborn stains after grinding, you can choose PVA sponges or nylon brushes for the brush. Since everything is custom-made, we can offer products that incorporate the customer's ideas.

  • Other cleaning machines
  • Other semiconductor manufacturing equipment

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Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc., 2 to 6 inches)

Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc., 2 to 6 inches)

A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Supports transparent wafers as well *For more details, please contact us or download the catalog to view.

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  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

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LT・SiC and other 2 to 6-inch small diameter wafer double-sided simultaneous chemical scrub cleaning device

LT・SiC and other 2 to 6-inch small diameter wafer double-sided simultaneous chemical scrub cleaning device

A chemical cleaning device that enables transportation and drying without touching the front and back of the workpiece, as well as the removal of foreign substances and metal contamination! It also supports a combination with brush cleaning using the chemical solution.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, followed by chemical spray, megasonic spot shower, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edge as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameter: φ2” to φ4”, thickness negotiable ■ Supports transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

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